About the job
Qualcomm Semiconductor Limited
Engineering Group, Engineering Group > ASICS Engineering
Qualcomm’s Package group is responsible for designing packages for various Qualcomm chipsets. This position is within the Packaging EDA team. The EDA Team develops tools, flows, and methodologies to address different aspects of Package design. We are looking for a highly motivated EDA engineer with experience in IC/IC Packaging/PCB software tools, and design flows to support or enhance the team’s functions through pathfinding/road mapping, scripting, and automating design methodologies. The ideal candidate should possess a can-do mentality and leverage an understanding of the package design methodology to proactively and creatively improve the package design process.
The candidate will be responsible for ensuring bug-free software design tools and environments for smooth and successful package design tape outs. When issues arise, the candidate will work with external software vendors or investigate internally on appropriate issue resolution.
Develop EDA tools and methodology to accelerate Design and Verification processes
Automate flows to enable Package engineers to perform early prototyping
The candidate will be responsible for ensuring bug-free software design tools and environments for smooth and successful package design tapeouts.
When issues arise, the candidate will work with external software vendors or investigate internally on appropriate issue resolution.
Interface with EDA vendors for driving known tool issues & enhancement requests to closure
Work in collaboration with the rest of the team to ensure optimal integration inside the overall CAD platform
Come-up with innovative solutions to ever-increasing design challenges
Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
2+ years Hardware Engineering experience or related work experience.
MS Electrical Engineering/Computer Science or equivalent experience
Proficient with Unix/Linux OS, utilities, and scripting
Writing scripts in : SKILL/RAVEL, Tcl/Tk, VB. PERL and Python in a production environment
Experience with version control systems is a plus
Experience in supporting Cadence SIP/APD , Siemens Xpedition or other pkge design/electrical modeling EDA tools preferred
Knowledge of Package/PCB design flows, design methods, design tools is a plus
Excellent communication and interpersonal skills.
Frequently transports between offices, buildings, and campuses up to ½ mile.
Frequently transports and installs equipment up to 5 lbs.
Performs required tasks at various heights (e.g., standing or sitting).
Monitors and utilizes computers and test equipment for more than 6 hours a day.
Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
Bachelors – Engineering, Bachelors – Science
2+ years ASIC design, verification, or related work experience.
Bachelors – Computer Engineering, Bachelors – Computer Science, Bachelors – Electrical Engineering
2+ years experience with scripting tools and programming languages. ,2+ years experience with architecture and design tools. ,4+ years ASIC design, verification, or related work experience. ,2+ years experience with design verification methods.
ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation Software
Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport
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